Chery unveiled its Ziwei automotive chip lineup at its global innovation conference on October 20. The portfolio comprises C-series central computing chips, S-series automotive silicon carbide chips and M-series vehicle-control chips, extending the automaker’s semiconductor development across computing and power electronics.
The C100 central computing chip targets on-device physical AI. Chery said a vehicle configuration with two neural processing units can deliver up to 2,400 TOPS, with memory bandwidth of 600GB per second, to support physical-world models with 100 billion parameters. Its S1500 silicon carbide product supports a voltage rating of 1,500V. Chery also announced that its eight-inch silicon carbide wafers have entered mass production, reducing costs by more than 30%, and displayed five chip-packaging families designed to cover its vehicle platforms. [IT Home, in Chinese]