As AI customers increasingly shift to more advanced 3nm and 2nm process technologies in pursuit of higher performance and lower power consumption, the surge in demand has prompted the world’s largest semiconductor foundry to adjust its production capacity plans.
According to Taiwan-based Economic Daily News, citing supply chain sources, strong order momentum from major customers including Nvidia, AMD, and Broadcom is expected to help TSMC reach its year-end target of 180,000 3nm wafers per month ahead of schedule, potentially as early as the fourth quarter.
TSMC has raised its capital expenditure for this year to $60 billion–64 billion, with around 70% to 80% allocated to advanced process technologies. The company is currently adding three new 3nm fabrication plants in Taiwan, Arizona, and Kumamoto, Japan, while continuing to convert existing 5nm production lines to support additional 3nm capacity.
Meanwhile, demand for TSMC’s 2nm process remains robust, with monthly wafer production expected to reach nearly 100,000 wafers by the end of this year, in line with the company’s production roadmap. [Icsmart, in Chinese]